Boson®+Model: Boson Plus 320, 12° (HFOV) 18 mm Go to Product Support
Made in the USA, the Boson+ sets the standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness. Lower video latency enhances tracking, seeker performance, and decision support. Radiometry will be available in the fourth quarter of 2023 on 640 x 512 and 320 x 256 resolution models.
Boson+ maintains the widely-deployed Boson mechanical, electrical, and optical interfaces enabling a plug-and-play upgrade. With customer-selectable USB, CMOS, or MIPI video interfaces, it is easier than ever to integrate Boson+ into a wider range of embedded processors from Qualcomm, Ambarella, and more. The user-friendly Boson SDK, GUI, and comprehensive product integration documentation further simplify OEM integration. Enhanced thermal performance and industry-leading reliability provide low-risk development, making Boson+ ideal for unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.